Product Description
DISCO ZHT-1218 2050 K59 Diamond Blade
The DISCO ZHT-1218 2050 K59 Diamond Blade is a premium-grade, high-precision dicing blade engineered for advanced semiconductor and microelectronic cutting applications. Manufactured in Japan to the highest industry standards, this diamond blade ensures exceptional cut quality, minimal chipping, and extended blade life. The ZHT-1218 specification combined with the 2050 K59 grade makes it an ideal choice for critical precision dicing tasks. Each securely designed case contains 10 pieces, providing reliable performance for demanding manufacturing environments.
Technical Specifications:
- Brand: DISCO
- Model: ZHT-1218 2050 K59
- Product Type: Precision Diamond Dicing Blade
- Package Quantity: 10 pieces (10 pcs.)
- Country of Origin: Made in Japan
- Intended Application: High-precision cutting and dicing of wafers and electronic components
DISCO ZHT-1218 2050 K59 Diamond Blade
Optimize your semiconductor dicing operations with the DISCO ZHT-1218 2050 K59 Diamond Blade. Made in Japan, this 10-piece pack of high-precision dicing blades delivers superior durability, clean cuts, and reliable performance for advanced microelectronic manufacturing.